Kuo: OpenAI phone is closer than we thought, to use a custom Dimensity SoC

OpenAI Smartphone Leaks: Custom Dimensity Chip, Accelerated Launch

Prepare for a significant shift in the smartphone landscape. Renowned analyst Ming-Chi Kuo has revealed that OpenAI's ambitious AI-focused smartphone initiative may be launching sooner than anticipated. Initial reports pointed towards mass production in 2028, but new insights suggest a dramatically accelerated timeline.

According to Kuo, the OpenAI smartphone is now slated to commence mass production in the first half of 2027. This expedited schedule is reportedly driven by the burgeoning AI phone market and a potential year-end initial public offering (IPO) for OpenAI.

Key Specifications Emerge for OpenAI's AI-Powered Device

Beyond the launch date, Kuo has shed light on crucial hardware details. MediaTek is positioned as the exclusive System-on-Chip (SoC) provider for this groundbreaking device. The smartphone is expected to feature a customized Dimensity 9600 chipset, manufactured using TSMC's advanced N2P process, with production commencing in the latter half of this year.

Imaging is highlighted as a core strength, with the Image Signal Processor (ISP) anticipated to boast an enhanced HDR pipeline, promising superior real-world visual sensing capabilities.

Further bolstering its AI prowess, the OpenAI phone will reportedly incorporate a dual-NPU architecture, optimized for complex AI tasks. It's also expected to be equipped with cutting-edge LPDDR6 RAM and UFS 5.0 storage. For robust security, the device is slated to support pKVM and inline hashing technologies.

Kuo projects that if development proceeds as planned, the OpenAI smartphone could achieve total shipments of 30 million units in 2027 and 2028, underscoring the significant market potential.

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