Honor 700 series chipset details leak

Honor is expected to unveil its 700 series in China this December. Ahead of the rumored launch, a tipster has revealed the chipsets expected to power the Honor 700 and Honor 700 Pro. Well-known tipster Digital Chat Station, who recently leaked that the Honor 700 series willsupport a teleconverter, has now shared more details about the upcoming phones.

According to the tipster, the base Honor 700 will be powered by the Snapdragon 8s Gen 4 chipset and feature a periscope telephoto rear camera. The Honor 700 Pro, meanwhile, is said to be equipped with the Snapdragon 8 Gen 5 chipset. Notably, arecent leakby the same tipster also suggested that the Pro model will get a 6.57-inch 1.5K display and a1.72-inch rear screen for selfies. It is also said to have a 200MP primary and a 50MP periscope telephoto camera. The phone is tipped to pack a battery with a capacity of around 9,000mAh. Source(In Chinese)