AMD buys HBM4 from Samsung for AI data centers

AMD Forges Strategic Alliance with Samsung for Cutting-Edge HBM4 to Power Next-Gen AI Data Centers

In a significant move poised to accelerate the future of artificial intelligence, AMD has officially committed to procuring Samsung's advanced HBM4 high-bandwidth memory. This crucial technology will power AMD's highly anticipated "AI accelerator," the Instinct MI455X GPU, alongside its 6th generation AMD Epyc CPUs, internally codenamed "Venice." This strategic integration is designed to provide AI data center operators with an unparalleled compute foundation, combining Instinct GPUs with Epyc CPUs within robust rack-scale architectures like the innovative AMD Helios platform, setting the stage for next-generation AI systems.

The landmark memorandum of understanding between these two tech giants was formally unveiled at Samsung's state-of-the-art chip manufacturing complex in Pyeongtaek, South Korea. The signing ceremony underscored the partnership's importance, drawing key leadership from both companies, including AMD CEO Dr. Lisa Su and Samsung Electronics CEO and Vice Chairman Young Hyun Jun.

Samsung's HBM4 represents a leap forward in memory technology, engineered on a sophisticated 10nm process with a 4nm logic base die. This architecture delivers impressive performance metrics:

• Processing speeds reaching up to 13Gbps
• A maximum bandwidth of a staggering 3.3TBps

Beyond HBM4, the collaboration extends to optimizing high-performance DDR5 memory specifically for AMD's 6th generation Epyc CPUs, ensuring seamless and efficient data handling. Furthermore, the official press release highlights ongoing discussions between Samsung and AMD regarding potential foundry partnership opportunities, signaling a deeper strategic alignment where Samsung could potentially provide critical manufacturing services for AMD's future product roadmap.

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