A variant of the Xiaomi 18 Ultra may use the Xring O3, Xiaomi's upcoming in-house chipset

About a year ago, Xiaomi introduced theXiaomi 15S Pro, its first phone to be powered byan in-house chipset, which was called the Xring O1. This was a variant of the Xiaomi 15 Pro, which originally ran on a Snapdragon 8 Elite. The company may be looking to do something similar this year, reports Yogesh Brar. The scuttlebutt is that there will be a version of the Xiaomi 18 Ultra powered by the Xring O3. That’s the next generation Ultra, which should arrive in December – according to Brar, the company isn’t planning on a global release for the Xring-based model, so it will be available only in China. Details on the Xring O3 (Lhasa)

Recently,Ximitimeuncovered interesting info about the Xring O3 (code name “Lhasa”) – Xiaomi has redesigned the CPU and boosted the GPU clock speed. The Xring O1 had an interestingfour-tier CPU structurewith two Cortex-X925 cores, two Cortex-A725 cores, then four lower-clocked A725 cores and two Cortex-A520 cores. These clusters were labeled “prime”, “titanium”, “big” and “little”. For the Xring O3, Xiaomi will do away with the “big” tier. Although looking at the planned clock speeds, it seems more accurate to say that the “little” tier will be taking over the role of the “big” tier. Here’s a breakdown: As you can see, the new “prime” cores – we don’t know the core counts yet – will crack the 4GHz barrier. And the “little” cores will be clocked significantly higher than the old “big” and “little” cores. Also, Xiaomi will bump up the GPU speed by 0.3GHz. That is an increase of 25%. The GPU design is unknown, but chances are that it will be anARM Mali G1-Ultra(the successor to the G925). By the same token, the CPU cores are likely ARM C1 cores. The RAM speed will remain the same, however. Source 1|Source 2