Honor Pad X8 Pro vs Amazon Fire Max 11

Phones Images
PHONES
Phone Names Honor Pad X8 Pro Amazon Fire Max 11
Network
2G bandsN/AN/A
3G bandsN/A-
4G bandsN/A-
EDGENoNo
GPRSNoNo
TechnologyNo cellular connectivityNo cellular connectivity
Launch
Announced2023, July 052023, May 23
StatusAvailable. Released 2023, July 05Available. Released 2023, May 23
Body
BuildGlass front, aluminum frame, aluminum back-
Dimensions267.3 x 167.4 x 6.9 mm (10.52 x 6.59 x 0.27 in)259.1 x 163.7 x 7.5 mm (10.20 x 6.44 x 0.30 in)
SIMNoNo
Weight495 g (1.09 lb)490 g (1.08 lb)
Display
Resolution1200 x 2000 pixels, 5:3 ratio (~203 ppi density)2000 x 1200 pixels, 5:3 ratio (~212 ppi density)
Size11.5 inches, 376.4 cm2 (~84.1% screen-to-body ratio)11.0 inches, 344.4 cm2 (~81.2% screen-to-body ratio)
TypeTFT LCD, 120HzIPS LCD
Platform
CPUOcta-core (4x2.8 GHz Cortex-A73 & 4x1.9 GHz Cortex-A53)Octa-core (2x2.2 GHz Cortex-A78 & 6x2.0 GHz Cortex-A55)
ChipsetQualcomm SM6225 Snapdragon 685 (6 nm)Mediatek MT8188J
GPUAdreno 610Mali-G57 MC2
OSAndroid 13, MagicOS 7.1Android 11, Fire OS 8
Memory
Card slotNomicroSDXC (dedicated slot)
Internal128GB 4GB RAM, 128GB 6GB RAM, 128GB 8GB RAM64GB 4GB RAM, 128GB 4GB RAM
Main Camera
FeaturesHDR-
Single5 MP, f/2.2, AF8 MP, AF
Video1080p@30fps1080p
Selfie camera
Single5 MP, f/2.28 MP
Video1080p@30fps1080p
Sound
35mm jackNoNo
Loudspeaker Yes, with stereo speakers (6 speakers)Yes, with stereo speakers
Comms
Bluetooth5.1, A2DP, LE5.3, A2DP, LE
NFCNoNo
PositioningUnspecifiedNo
RadioNoNo
USBUSB Type-C, OTGUSB Type-C 2.0, OTG, magnetic accessory connector
WLANWi-Fi 802.11 a/b/g/n/ac, dual-bandWi-Fi 802.11 a/b/g/n/ac/6, dual-band
Features
SensorsAccelerometerFingerprint (side-mounted), accelerometer, proximity (accessories only)
Battery
Charging-15W wired
TypeLi-Po 7250 mAhLi-Ion
Misc
ColorsGray, Purple, MintGray
Models-KFSNWI
PriceAbout 130 EURAbout 270 EUR